OhmegaPly RCM is laminated to a dielectric material (like any other copper foil) and subtractively processed to produce copper circuitry and planar resistors. OhmegaPly RCM can be bonded to almost any dielectric material including FR4, Lead-Free, Polyimide, PTFE, LCP and flexible dielectric materials. OhmegaPly laminates are offered by Ohmega Technologies who subcontracts the lamination to the Independent Laminators. It is also directly available from Arlon, Rogers and Taconic bonded to PTFE and other RF dielectric materials.